Ren Xiaochuan,Zheng Dong,Wang Shibin,Li Linan (Dept.of Mechanical Engineering.Tianjin University 300072)
<正>Recently great interest has been paid to the delamination and buckling of thin films deposited on substrates for their wide application.Investigation of thin film buckling is important for life prediction of MEMS(Micro-electronic Mechanical System) device because delamination and buckling is the main damage mechanism.In this paper,the mechanical and thermal properties of thin film materials with 150nm thickness under mechanical and thermal loads are measured and characterized.
Thin Film Buckling;;electrical film;;thermocouple;;Symmetric Loading Device;;Nano-scale
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