Mechanics of epidermal electronics


Shuodao Wang;Jian Wu;Yonggang Huang;John A.Rogers;


<正>We report classes of electronic systems that achieve thicknesses, effective elastic moduli,bending stiffnesses and areal mass densities matched to the epidermis.Unlike traditional wafer-based technologies,laminating such devices onto the skin leads to conformal contact,and adequate adhesion based on van der Waals interactions alone,in a manner that is mechanically invisible to the user.This concept could be used to build systems incorpo-


Mechanics of epidermal electronics;


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