A high sensitivity DIC technique for chip-level packaging materials

【Author】

Yonggang Wang;Wei Tong;

【Abstract】

<正>We present an experimental investigation on a high-sensitivity digital image correlation(DIC) based strain measurement technique. The technique is developed for applications of characterizing small thermal deformation of microelectronics packaging materials at the silicon chip level.By using a reference glass-ceramic material of very low thermal expansion,a high-speed digital cam-

【Keywords】

DIC;high;A high sensitivity DIC technique for chip-level packaging materials;

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