Interface Stability of Skutterudite Thermoelectric Materials/Ti 88Al 12

【Author】

ZHANG Qi-Hao;LIAO Jin-Cheng;TANG Yun-Shan;GU Ming;LIU Rui-Heng;BAI Sheng-Qiang;CHEN Li-Dong

【Institution】

State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences;University of Chinese Academy of Sciences;State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences;State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences;State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences;State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences;State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences;State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences

【Abstract】

Interface stability is one of the key issues determining the service reliability and life of thermoelectric devices. For skutterudite-based thermoelectric devices, the barrier layer is required in order to restrain the inter-diffusion between the hot-side electrode and skutterudite matrix. In this work, Ti 88Al 12 was selected as the barrier layer. n-type Yb 0.3Co 4Sb 12/Ti 88Al 12/Yb 0.3Co 4Sb 12 and p-type CeFe 3.85Mn 0.15Sb 12/Ti 88Al 12/Ce Fe 3.85Mn 0.15Sb 12 thermoelectric joints were prepared by one-step hot press sintering method. The evolution processes of contact resistivity and microstructure were studied through accelerated aging experiments. The results show that the contact resistivity of n-type joints increases slower than that of p-type joints under the same aging condition. Activation energy for n-type and p-type joints is 84.1 kJ/mol and 68.8 kJ/mol, respectively. Growth of the inter-metallic compound layer and cracking at the AlCo/TiCoSb interface result in rapidly increased contact resistivity of n-type joints. For p-type joints, the difference of coefficient of thermal expansion between CeFe 3.85Mn 0.15Sb 12 and Ti 88Al 12 becomes the main reason for the cracks.

【Keywords】

skutterudite;interface stability;barrier layer;contact resistivity

References

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Total: 21 articles

  • [1] TANG Yun-Shan;BAI Sheng-Qiang;REN Du-Di;LIAO Jin-Cheng;ZHANG Lan-Ting;CHEN Li-Dong;School of Materials Science and Engineering, Shanghai Jiao Tong University;CAS Key Laboratory of Energy-conversation Materials, Shanghai Institute of Ceramics, Chinese Academy of Sciences;, Interface Structure and Electrical Property of Yb_(0.3)Co_4Sb_(12)/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder, Journal of Inorganic Materials,
  • [2] Degang Zhao;;Xiaoya Li;;Lin He;;Wan Jiang;;Lidong Chen, High temperature reliability evaluation of CoSb 3 /electrode thermoelectric joints, Intermetallics,
  • [3] Degang Zhao;;Xiaoya Li;;Lin He;;Wan Jiang;;Lidong Chen, Interfacial evolution behavior and reliability evaluation of CoSb 3 /Ti/Mo–Cu thermoelectric joints during accelerated thermal aging, Journal of Alloys and Compounds,
  • [4] Mohamed S. El-Genk;;Hamed H. Saber;;Thierry Caillat;;Jeff Sakamoto, Tests results and performance comparisons of coated and un-coated skutterudite based segmented unicouples, Energy Conversion and Management,

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